Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

Download:

Excel

Use~for the exact search match (i.e. ~NTS2101PT1).

3 Non-hybrid devices found

Non-hybrid devices

Page size:

1 - 3 of 3

Base part	Part	Status	Mold Compound-Black							Mold Compound-White						Lead Frame					Die Attach			Plating		Die			Wire Bond - Au		Coupling Gel		TOTAL
			Brominated Epoxy Resin-2 [%]	Ortho Cresol Novolac Resin [%]	Antimony Trioxide (Sb2O3) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Titanium Dioxide (TiO2) [%]	Zirconium Dioxide (ZrO2) [%]	Ortho Cresol Novolac Resin [%]	Silica Amorphous (SiO2) [%]	Aluminum Trioxide (Al2O3) [%]	Weight [mg]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Ortho Cresol Novolac Resin [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Gallium Arsenide (AsGa) [%]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	3-Methacryloxypropyltrimethoxysilane (C10H20O5Si) [%]	Weight [mg]	Weight [mg]
			68541-56-0	29690-82-2	1309-64-4	1333-86-4	60676-86-0	9003-35-4	n/a	13463-67-7	1314-23-4	29690-82-2	7631-86-9	1344-28-1	n/a	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	29690-82-2	n/a	7440-31-5	n/a	1303-00-0	7440-21-3	n/a	7440-57-5	n/a	2530-85-0	n/a	n/a
MCT61	MCT61	Active	2.49992	14.9995	1.99994	0.503199	69.9977	9.99968	93.303	20.2581	0.502586	76.0305	2.16499	1.04383	258.662	0.12	2.3587	97.5	0.0213044	115	83	17	0.25	100	11.6	33.3333	66.6667	0.099	100	0.05	100	64	542.964
MCT61	MCT61S	Active	2.49992	14.9995	1.99994	0.503199	69.9977	9.99968	93.303	20.2581	0.502586	76.0305	2.16499	1.04383	258.662	0.12	2.3587	97.5	0.0213044	115	83	17	0.25	100	11.6	33.3333	66.6667	0.099	100	0.05	100	64	542.964
MCT61	MCT61SD	Active	2.49992	14.9995	1.99994	0.503199	69.9977	9.99968	93.303	20.2581	0.502586	76.0305	2.16499	1.04383	258.662	0.12	2.3587	97.5	0.0213044	115	83	17	0.25	100	11.6	33.3333	66.6667	0.099	100	0.05	100	64	542.964

Page size:

1 - 3 of 3

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.