Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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13 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black						Lead Frame					Die Attach						Die Attach Epoxy					Plating				Die			Wire Bond - Au		Backside Protection Film					Solder Ball				Under Bump Metal			TOTAL
				Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Ortho-Cresol Novolac Resin [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Isobornyl Methacrylate [%]	Silver (Ag) [%]	Isobornyl Acrylate [%]	Misc. [%]	Tricyclo[5.2.1.02,6]decanedimethanol Diacrylate (C18H24O4) [%]	Weight [mg]	Poly(oxypropylene)diamine [%]	Miscellaneous [%]	Silver (Ag) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Aluminum (Al) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Epoxy resin [%]	Carbon Black (C) [%]	Acrylic resins [%]	Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Titanium (Ti) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				29690-82-2	1333-86-4	60676-86-0	29690-82-2	9003-35-4	n/a	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	7534-94-3	7440-22-4	5888-33-5	proprietary data	42594-17-2	n/a	9046-10-0	trade secret	7440-22-4	9003-35-4	n/a	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	7429-90-5	n/a	7440-57-5	n/a	proprietary data	1333-86-4	proprietary data	14464-46-1	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	7440-32-6	7440-50-8	n/a	n/a
FUSB302B	FUSB302B01MPX	Active	Y	9.98906	0.984324	89.0266			2.743	0.120636	2.34885	97.5021	0.0283849	14.092							3	5	85	7	0.06	8.73786	89.3204	1.94175	0.103	100		0.438	100	0.397													17.833
FUSB302B	FUSB302B10MPX	Active	Y		0.5	88	6.5	5	2.743	0.120636	2.34885	97.5021	0.0283849	14.092	6	81.5	6	0.5	6	0.06						8.73786	89.3204	1.94175	0.103	100		0.438	100	0.397													17.833
FUSB302B	FUSB302B11MPX	Active	Y	9.98906	0.984324	89.0266			2.743	0.120636	2.34885	97.5021	0.0283849	14.092							3	5	85	7	0.06	8.73786	89.3204	1.94175	0.103	100		0.438	100	0.397													17.833
FUSB302B	FUSB302BMPX	Active	Y		0.5	88	6.5	5	2.743	0.120636	2.34885	97.5021	0.0283849	14.092	6	81.5	6	0.5	6	0.06						8.73786	89.3204	1.94175	0.103	100		0.438	100	0.397													17.833
FUSB302B	FUSB302BUCX	Active	Y																											99.452	0.54805	1.27178			20.93	1.84	20.93	56.3	0.057028	3.9	95.5	0.6	0.547544	0.62	99.38	0.025924	1.902276
FUSB302B	FUSB302BVMPX	Active	Y	9.98906	0.984324	89.0266			2.743	0.120636	2.34885	97.5021	0.0283849	14.092							3	5	85	7	0.06	8.73786	89.3204	1.94175	0.103	100		0.438	100	0.397													17.833
	FUSB302MPX	Active, Not Rec	Y		0.5	88	6.5	5	2.743	0.12	2.35	97.5	0.03	14.092	6	81.5	6	0.5	6	0.06						8.73786	89.3204	1.94175	0.103	100		0.438	100	0.397													17.833
FUSB302T	FUSB302TMPX	Active	Y	9.98906	0.984324	89.0266			2.743	0.120636	2.34885	97.5021	0.0283849	14.092							3	5	85	7	0.06	8.73786	89.3204	1.94175	0.103	100		0.438	100	0.397													17.833
FUSB302T	FUSB302TV01MPX	Active	Y		0.5	88	6.5	5	1.543	0.12	2.35	97.5	0.03	14.092	6	81.5	6	0.5	6	0.22						8.73786	89.3204	1.94175	0.103	100		1.638	100	0.397													17.993
FUSB302T	FUSB302TV10MPX	Active	Y		0.5	88	6.5	5	1.543	0.12	2.35	97.5	0.03	14.092	6	81.5	6	0.5	6	0.22						8.73786	89.3204	1.94175	0.103	100		1.638	100	0.397													17.993
FUSB302T	FUSB302TV11MPX	Active	Y		0.5	88	6.5	5	1.543	0.12	2.35	97.5	0.03	14.092	6	81.5	6	0.5	6	0.22						8.73786	89.3204	1.94175	0.103	100		1.638	100	0.397													17.993
FUSB302T	FUSB302TVMPX	Active	Y		0.5	88	6.5	5	1.543	0.12	2.35	97.5	0.03	14.092	6	81.5	6	0.5	6	0.22						8.73786	89.3204	1.94175	0.103	100		1.638	100	0.397													17.993
	FUSB302UCX	Active, Not Rec	Y																											99.452	0.54805	1.27178			20.93	1.84	20.93	56.3	0.057028	4	95.5	0.5	0.547544	0.62	99.38	0.025924	1.902276

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.