Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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4 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	Mold Compound-Black						Mold Compound-White				Lead Frame					Die Attach Epoxy					Plating		Die				Wire Bond - Au		Coupling Gel			TOTAL
			Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Aluminum Hydroxide (Al(OH)3) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Ortho Cresol Novolac Resin [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Ortho Cresol Novolac Resin [%]	Silica Amorphous (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Gallium Arsenide (AsGa) [%]	Silicon (Si) [%]	Aluminum (Al) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Filler (SiO2) [%]	Dimethyl Siloxane [%]	Weight [mg]	Weight [mg]
			29690-82-2	1333-86-4	21645-51-2	60676-86-0	9003-35-4	n/a	29690-82-2	60676-86-0	9003-35-4	n/a	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	29690-82-2	7631-86-9	9003-35-4	n/a	7440-31-5	n/a	1303-00-0	7440-21-3	7429-90-5	n/a	7440-57-5	n/a	68909-20-6	68083-19-2	n/a	n/a
FODM217A	FODM217A	Active	13	1	9	70	7	18.1	20	70	10	14.126	0.12	2.35	97.5	0.03	21.956	85	6.5	2	6.5	0.48	100	0.1	32.3529	65.6863	1.96078	0.16	100	0.4	20	80	2	57.322
FODM217A	FODM217AR2	Active	13	1	9	70	7	18.1	20	70	10	14.126	0.12	2.35	97.5	0.03	21.956	85	6.5	2	6.5	0.48	100	0.1	32.3529	65.6863	1.96078	0.16	100	0.4	20	80	2	57.322
FODM217A	FODM217AR2V	Active	13	1	9	70	7	18.1	20	70	10	14.126	0.12	2.35	97.5	0.03	21.956	85	6.5	2	6.5	0.48	100	0.1	32.3529	65.6863	1.96078	0.16	100	0.4	20	80	2	57.322
FODM217A	FODM217AV	Active	13	1	9	70	7	18.1	20	70	10	14.126	0.12	2.35	97.5	0.03	21.956	85	6.5	2	6.5	0.48	100	0.1	32.3529	65.6863	1.96078	0.16	100	0.4	20	80	2	57.322

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.