Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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4 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	Mold Compound-Black						Lead Frame						Die Attach			Plating		Die			Wire Bond - Au		Coupling Gel		TOTAL
			Titanium Dioxide (TiO2) [%]	2,6-dibromo-4-[1-(3-bromo-4-hydroxyphenyl)-1-methylethyl]phenol [%]	Ortho Cresol Novolac Resin [%]	Antimony Trioxide (Sb2O3) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Phenolic Resin-2 [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Gallium Arsenide (AsGa) [%]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Dimethyl Siloxane [%]	Weight [mg]	Weight [mg]
			13463-67-7	6386-73-8	29690-82-2	1309-64-4	60676-86-0	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	54208-63-8	n/a	7440-31-5	n/a	1303-00-0	7440-21-3	n/a	7440-57-5	n/a	68083-19-2	n/a	n/a
FOD8320	FOD8320	Active	20.0026	4.00052	22.99	3.00039	50.0065	153.98	0.549571	0.120906	2.29996	96.9993	0.0302264	36.392	80	20	0.223	100	1.69	6.27763	93.7224	1.131	100	0.235	100	3.5	197.151
FOD8320	FOD8320R2	Active	20.0026	4.00052	22.99	3.00039	50.0065	153.98	0.549571	0.120906	2.29996	96.9993	0.0302264	36.392	80	20	0.223	100	1.69	6.27763	93.7224	1.131	100	0.235	100	3.5	197.151
FOD8320	FOD8320R2V	Active	20.0026	4.00052	22.99	3.00039	50.0065	153.98	0.549571	0.120906	2.29996	96.9993	0.0302264	36.392	80	20	0.223	100	1.69	6.27763	93.7224	1.131	100	0.235	100	3.5	197.151
FOD8320	FOD8320V	Active	20.0026	4.00052	22.99	3.00039	50.0065	153.98	0.549571	0.120906	2.29996	96.9993	0.0302264	36.392	80	20	0.223	100	1.69	6.27763	93.7224	1.131	100	0.235	100	3.5	197.151

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.