Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Exempt	Mold Compound-Black								Lead Frame					Die Attach			Die Attach Solder				Plating		Die		Wire Bond - Al		TOTAL
					Polymer(phenyl glycidil ether)-co-dicyclopentadiene [%]	Proprietary [%]	Carbon Black (C) [%]	Aluminum Hydroxide (Al(OH)3) [%]	Fused Silica (SiO2) [%]	Ortho-Cresol Novolac Resin [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Weight [mg]	Silver (Ag) [%]	Lead (Pb) [%]	Tin (Sn) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Aluminum (Al) [%]	Weight [mg]	Weight [mg]
					119345-05-0	proprietary data	1333-86-4	21645-51-2	60676-86-0	29690-82-2	9003-35-4	n/a	7440-02-0	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	7440-31-5	n/a	7440-22-4	7439-92-1	7440-31-5	n/a	7440-31-5	n/a	7440-21-3	n/a	7429-90-5	n/a	n/a
FCH023N65S3	FCH023N65S3-F155	Active		7a	5	5	0.5	4.5	75	5	5	1740		0.1	99.87	0.03	3612.9				2.5	92.5	5	35.025	100	31	100	32	100	6	5456.925
FCH023N65S3L4	FCH023N65S3L4	Active	Y		5	5	0.5	4.5	75	5	5	2403.94	0.24	0.15	99.57	0.04	3982.39	20	80	6.22					100	23.4	100	12.08	100	11.76	6439.79

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.