Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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4 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black					Die Attach										Die				Wire Bond - Au		Solder Ball				Substrate								Substrate and Solder Mask						Substrate Copper Foil		Substrate Plating-Au		Substrate Plating-Cu		Substrate Plating-Ni		TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Bismaleimide Monomer [%]	POLY(ETHYLENE GLYCOL) PHENYL ETHER ACRYLATE [%]	2,2-Bis(4-hydroxyphenyl)propane-epichlorohydrin copolymer acrylate [%]	Bis(4-tert-butylcyclohexyl) peroxydicarbonate [%]	2,2-dimethyl-1,3-propanediyl dimethacrylate [%]	2-phenoxy ethyl acrylate [%]	Bisphenol A_Epichlorohydrin Polymer [%]	Other Additive Agents [%]	Formaldehyde Polymer [%]	Weight [mg]	Misc. [%]	Silicon (Si) [%]	Aluminum (Al) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Epoxy resin [%]	Boehmit (Al(OH)O) [%]	Fiber Glass (SiO2) [%]	Silica Amorphous (SiO2) [%]	Misc. [%]	Polycarbonite [%]	Bismaleimide Triazine resin [%]	Weight [mg]	Talc [%]	Epoxy Resin [%]	Silica Amorphous (SiO2) [%]	Misc. [%]	Barium Sulfate (BaSO4) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Nickel (Ni) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	1333-86-4	60676-86-0	n/a	proprietary data	56641-05-5	55818-57-0	15520-11-3	1985-51-9	48145-04-6	25068-38-6	proprietary data	9003-36-5	n/a	proprietary data	7440-21-3	7429-90-5	n/a	7440-57-5	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	proprietary data	1318-23-6	65997-17-3	7631-86-9	proprietary data	80-05-7	proprietary data	n/a	14807-96-6	26875-67-2	7631-86-9	proprietary data	7727-43-7	n/a	7440-50-8	n/a	7440-57-5	n/a	7440-50-8	n/a	7440-02-0	n/a	n/a
AP0200AT	AP0200AT2L00XEGA0-DR	Active	Y	4.5	4.5	0.3	90.7	33.58	38.5	0.5	10	0.5	10	10	0.5	20	10	0.9	0.29	99.61	0.1	8.58	100	0.95	3	96.5	0.5	10.5	14.7	30.5	23	1.8	8.5	1	20.5	20	3.6	61.6	1	2.7	31.1	2.48	100	8.66	100	1.18	100	1.05	100	3.36	91.24
AP0200AT	AP0200AT2L00XEGA0-DR1	Last Shipments	Y	4.5	4.5	0.3	90.7	33.58	38.5	0.5	10	0.5	10	10	0.5	20	10	0.9	0.29	99.61	0.1	8.58	100	0.95	3	96.5	0.5	10.5	14.7	30.5	23	1.8	8.5	1	20.5	20	3.6	61.6	1	2.7	31.1	2.48	100	8.66	100	1.18	100	1.05	100	3.36	91.24
AP0200AT	AP0200AT2L00XEGA0-TR	Last Shipments	Y	4.5	4.5	0.3	90.7	33.58	38.5	0.5	10	0.5	10	10	0.5	20	10	0.9	0.29	99.61	0.1	8.58	100	0.95	3	96.5	0.5	10.5	14.7	30.5	23	1.8	8.5	1	20.5	20	3.6	61.6	1	2.7	31.1	2.48	100	8.66	100	1.18	100	1.05	100	3.36	91.24
	AP0200ATSL00XUGA0-DR-E	Obsolete	Y	No data available

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.