Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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4 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black						Lead Frame									Die Attach					Die Attach Epoxy					Plating				Die		Wire Bond - Au		TOTAL
				Epoxy resin [%]	Phenol Resin [%]	Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Magnesium (Mg) [%]	Zinc (Zn) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Ethylene glycol dicyclopentenyl ether methacrylate [%]	Bis(a,a-dimethylbenzyl) Peroxide [%]	Silver (Ag) [%]	Phenolic Resin-2 [%]	Weight [mg]	Poly(oxypropylene)diamine [%]	Miscellaneous [%]	Silver (Ag) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	29690-82-2	1333-86-4	60676-86-0	n/a	7440-22-4	7439-95-4	7440-66-6	7440-21-3	7440-02-0	7439-89-6	7440-50-8	7723-14-0	n/a	68586-19-6	80-43-3	7440-22-4	54208-63-8	n/a	9046-10-0	trade secret	7440-22-4	9003-35-4	n/a	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
74LCX126	74LCX126BQX	Active	Y			10	1	89	10.2			0.12382			2.35258	97.4926	0.030955	6.461						3	5	85	7	0.059	9.09091	89.3939	1.51515	0.066	100	0.115	100	0.348	17.249
74LCX126	74LCX126MTC	Last Shipments	Y			20	1	79	32.2		0.148402		0.64926	3.20456		95.9978		21.563			80	20	0.055						3.10559	95.0311	1.86335	0.161	100	0.496	100	0.348	54.823
74LCX126	74LCX126MTCX	Active	Y	9.5	5		0.5	85	32.2		0.148402		0.64926	3.20456		95.9978		21.563	3.5	0.65	95.85		0.055						3.10559	95.0311	1.86335	0.161	100	0.496	100	0.348	54.823
74LCX126	74LCX126MX	Last Shipments	Y			20.0002	1.00032	78.9994	81.974	0.0218309		0.125164			2.349	97.4225	0.081502	68.71			78.5	21.5	0.367						3.60169	94.3856	2.01271	0.944	100	3.63	100	0.28	155.905

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.