Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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5 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	Mold Compound-White							Lead Frame						Die Attach					Plating		Die		Wire Bond - Au		Coupling Gel			Die GaAs		TOTAL
			Titanium Dioxide (TiO2) [%]	Brominated Bisphenol A Diglycidyl Ether [%]	Ortho Cresol Novolac Resin [%]	Antimony Trioxide (Sb2O3) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Phenolic Resin-2 [%]	Dicyandiamine [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Dimethyl Cyclosiloxanes [%]	Trimethoxy(methyl)silane (C4H12O3Si) [%]	Weight [mg]	Gallium Arsenide (AsGa) [%]	Weight [mg]	Weight [mg]
			13463-67-7	40039-93-8	29690-82-2	1309-64-4	60676-86-0	9003-35-4	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	54208-63-8	461-58-5	9003-35-4	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	69430-24-6	1185-55-3	n/a	1303-00-0	n/a	n/a
4N32M	4N32M	Active	25	3	13.5	3	50	5.5	327.22	0.627758	0.120013	2.28947	96.9332	0.0295416	108.322	82		1	17	0.3	100	6.7	100	0.37	100	1.65	10	90	0.4	100	0.11	445.072
4N32M	4N32SM	Active	25	3	13.5	3	50	5.5	327.22	0.400185	0.199601	2.59579	96.654	0.150438	101.703	75	25			0.3	100	28.5	100	5.13	100	1.65	10	90	0.4			464.903
4N32M	4N32SR2M	Active	25	3	13.5	3	50	5.5	327.22	0.400185	0.199601	2.59579	96.654	0.150438	101.703	75	25			0.3	100	28.5	100	5.13	100	1.65	10	90	0.4			464.903
4N32M	4N32TVM	Active	25	3	13.5	3	50	5.5	327.22	0.627758	0.120013	2.28947	96.9332	0.0295416	108.322	75	25			0.3	100	6.7	100	5.13	100	1.65	10	90	0.4			449.722
4N32M	4N32VM	Active	25	3	13.5	3	50	5.5	327.22	0.627758	0.120013	2.28947	96.9332	0.0295416	108.322	82		1	17	0.3	100	6.7	100	0.37	100	1.65	10	90	0.4	100	0.11	445.072

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.