Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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9 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	Mold Compound-Black								Lead Frame							Plating		Die		Wire Bond - Au		TOTAL
			Phenol Resin [%]	2,6-dibromo-4-[1-(3-bromo-4-hydroxyphenyl)-1-methylethyl]phenol [%]	Ortho Cresol Novolac Resin [%]	Antimony Trioxide (Sb2O3) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Ortho-Cresol Novolac Resin [%]	Weight [mg]	Silver (Ag) [%]	Manganese (Mn) [%]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
			proprietary data	6386-73-8	29690-82-2	1309-64-4	1333-86-4	60676-86-0	29690-82-2	n/a	7440-22-4	7439-96-5	7440-02-0	7439-89-6	7440-50-8	7723-14-0	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
2N5551T	2N5551BU	Active		3	20	2.5	0.75	73.75		112	0.99999	0.499995	0.180196	97.4248	0.895041		101.001	100	9.94	100	0.075	100	0.076	223.092
2N5551	2N5551G	Obsolete	No data available
2N5551	2N5551RL1G	Obsolete	No data available
2N5551	2N5551RLRAG	Obsolete	No data available
2N5551	2N5551RLRPG	Obsolete	No data available
2N5551T	2N5551TA	Active	10				1	77	12	112	0.01			0.1	99.86	0.03	101	100	5.85	100	0.075	100	0.076	219.001
2N5551T	2N5551TF	Active	10				1	77	12	112	0.01			0.1	99.86	0.03	101	100	5.85	100	0.075	100	0.076	219.001
2N5551T	2N5551TFR	Active	10				1	77	12	112	0.01			0.1	99.86	0.03	101	100	5.85	100	0.075	100	0.076	219.001
2N5551	2N5551ZL1G	Obsolete	No data available

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.