Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Exempt	Plating		Die					CSS Wire			Dumet Wire						Glass Encapsulation						Marking Ink									TOTAL
					Tin (Sn) [%]	Weight [mg]	Titanium (Ti) [%]	Silver (Ag) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Weight [mg]	Iron (Fe) [%]	Copper (Cu) [%]	Weight [mg]	Manganese (Mn) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Weight [mg]	Boron Trioxide (B2O3) [%]	Lead Oxide (PbO) [%]	Antimony Trioxide (Sb2O3) [%]	Potassium Monoxide (K2O) [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Titanium Dioxide (TiO2) [%]	Formaldehyde, polymer with 4,4-(1-methylethylidene)bisphenol [%]	Proprietary [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Diethylene glycol 2-ethyhexyl-ether [%]	Amino Resin [%]	2,2,4-Trimethyl-1,3-pentanediol di is Obutyrate [%]	Weight [mg]	Weight [mg]
					7440-31-5	n/a	7440-32-6	7440-22-4	7440-21-3	7440-02-0	n/a	7439-89-6	7440-50-8	n/a	7439-96-5	7440-21-3	7440-02-0	7439-89-6	7440-50-8	n/a	1303-86-2	1317-36-8	1309-64-4	12136-45-7	14808-60-7	n/a	13463-67-7	25085-75-0	proprietary data	7631-86-9	1333-86-4	1559-36-0	68002-20-0	6846-50-0	n/a	n/a
1N4454	1N4454	Active	Y	7c	100	2.626	0.1	47.32	52.16	0.42	0.024358	85	15	75	1	0.7	31.5	43.3	23.5	8.5	3	61.2	0.05	3.75	32	23.5	20.46	26.6	4.7	5.07	6.66	12.8	17.05	6.66	0.01953	109.669888
1N4454	1N4454TR	Active	Y	7c	100	2.626	0.1	47.32	52.16	0.42	0.024358	85	15	75	1	0.7	31.5	43.3	23.5	8.5	3	61.2	0.05	3.75	32	23.5	20.46	26.6	4.7	5.07	6.66	12.8	17.05	6.66	0.01953	109.669888

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.